LED Cure Technologies: An Emerging Option for Your State-of-the-Art Medical Device Assembly Process

Posted on 5/8/2014 2:13:52 PM By Hisco


Light-cure adhesive technologies are critical to many of today’s state-of-the-art medical device assembly processes.

As the industry continues to evolve toward single-use, disposable devices and pricing pressures from healthcare providers escalate, medical device manufacturers must embrace technologies that facilitate high-volume, low cost production—all without compromising the rigorous quality standards that define this market. Light-cure adhesives, with their cure-on-demand capacity, pave the way for more efficient manufacturing of a wide range of medical products, including syringe assemblies, balloon catheters, tubing connectors, endoscopes and ostomy devices.

Traditionally, light-curing of adhesives relies on high-intensity light sources such as high pressure mercury arc lamps and electrodeless fusion bulbs.  The recent introduction of light emitting diode (LED) cure systems, however, offers an attractive alternative. LED technology holds the promise of reduced energy consumption, lower operating costs, minimal heat transfer and improved safety. With these potential benefits in mind, medical device design and process engineers may be considering LED-curing either to retrofit an existing process or to facilitate a next-generation assembly. Optimal specification of the most appropriate cure system, whether LED or conventional, requires consideration of a constellation of factors. Foremost, designers must be aware of the inherent differences in the performance characteristics of these curing systems and how these may impact processing as well as the quality and functionality of the end product.

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