The bonding process can be thought of as four steps:
1. Surface preparation to facilitate (or allow) wetting of the surface by the adhesive. The better an adhesive wets the surface, the better the bond.
2. Adhesive application.
3. Joining the substrates and closing the bond line within the open time and work life of the adhesive.
4. Applying pressure for the proper time-to-handling-strength before the parts can be moved.